INDIANAPOLIS – Indiana Governor Mike Braun joined executives of SK hynix today in West Lafayette to break ground on the company’s new next-generation High Bandwidth Memory (HBM) production hub, the latest step in a $4 billion investment in Indiana that is expected to create a robust semiconductor ecosystem supporting 7,000 direct and indirect local jobs.
“With this milestone for Indiana’s semiconductor momentum, we are breaking ground on the future of U.S. innovation, AI and next-generation manufacturing right here in the Hoosier State,” said Gov. Braun. “SK hynix’s decision to locate its U.S. production hub in Indiana is a confirmation that our robust economy, vibrant communities and skilled talent pipeline will contribute to the company’s long-term growth. This transformational project cements our state as a high-tech hub, creating thousands of new, high-wage job opportunities for Hoosiers.”
SK hynix, headquartered in South Korea, announced plans to establish an advanced packaging production facility for AI memory in West Lafayette in 2024 – the company’s first HBM production based in the U.S. – and has already built a robust ecosystem for its Indiana fab that includes more than 100 partners across materials, components and equipment. The company expects to open its cleanroom by the fourth quarter of 2028 and initiate mass production at its new facility in the second half of 2029, supporting a workforce of approximately 1,000 personnel during anticipated commercial operations.
Today’s groundbreaking was attended by prominent representatives of the U.S. government, academic and industry leaders, including U.S. Senator Todd Young, Purdue University President Mitch Daniels, South Korean Ambassador to the United States Kang Kyung-wha, and Chairman of the Korea-US Alliance Foundation Robert Abrams.
“Today marks the day when the United States and SK hynix embark on a new future of AI together,” said Kwak Noh-Jung, CEO of SK hynix. “The United States is the epicenter of AI innovation, bringing together premier customers, top-tier R&D capabilities, and partners. We will expand our investments and collaboration in the U.S., grow together, and become the most trusted partner in shaping the future of AI in America.”
SK hynix’s investment in Indiana is expected to catalyze the country’s memory supply chain and AI ecosystem. The company will build an “Advanced Packaging R&D Testbed” alongside its production lines, enabling customers, universities and business partners to collaboratively develop next-generation packaging technologies and rapidly execute prototype fabrication and performance validation. Additionally, the company will partner with Purdue University to advance R&D, establishing a fund for next-generation research system integration and advanced packaging technologies.
The new hub will also strengthen the growing ties between Indiana and South Korea and enhance economic cooperation between South Korea and the United States. Indiana is home to 15 South Korea-based companies, including SK hynix, representing more than $14 billion of committed capital investment.
Project Support:
Kang Kyung-wha, South Korean Ambassador to the United States: “SK hynix’s investment in Indiana is not merely an investment in semiconductor manufacturing facilities, but the establishment of the first AI memory production facility and R&D center in the United States, creating a unique model for nurturing semiconductor talent and strengthening collaboration with the government and external organizations.”
Indiana Secretary of Commerce Chuck Goodrich: “SK hynix’s commitment to Indiana continues to deliver new opportunities for economic growth, workforce development and unmatched innovation that will propel our state forward. This new fab will support 1,000 high-wage jobs for Hoosiers and create approximately 7,000 total jobs across construction and the larger ecosystem, creating unprecedented high-wage and in-demand career opportunities. We look forward to partnering with SK hynix for years to come as we solidify Indiana as a global destination for next-generation memory and AI.”
